Program · ASD 2027 · Area Selective Deposition Workshop

Robert D. Clark

Director of TEL U.S. R&D Strategic Partnerships, Tokyo Electron US, USA

“Area selective deposition integration and applications”

Mikko Ritala

Professor, Department of Chemistry, University of Helsinki, Finland

“Methods for in situ and in vacuo characterization of ALD and ASD processes”

Simon Elliot

Director, Atomic level process simulation, Schrödinger, Ireland

“AI/ML for area-selective deposition”

Rong Chen

Professor, Huazhong University of Science and Technology, China

“Designing Selectivity in ASD: From Surface Chemistry to Selective Growth”

Adriaan J.M. Mackus

Associate Professor, Plasma and Materials Processing, Applied Physics Department, Eindhoven University of Technology, Netherlands

“From Inhibition to Selectivity: Mechanistic Insights into Area-Selective ALD”

Christophe Vallée

Professor, College of Nanotechnology, Science, and Engineering, Department of Nanoscale Science & Engineering, University at Albany, USA

“Area selective deposition by Plasma-Enhanced Chemical Vapor Deposition”

Anjana Devi

Director of the Institute for Materials Chemistry, Leibniz Institute for Solid State and Materials Research Dresden, Germany

“Ligand Design and Reactivity Tuning: Tailoring Precursors for Area-Selective Deposition”

Angel Yanguas-Gil

Director, Argonne Microelectronics Institute, Argonne National Laboratory, USA

“How to build AI agents for autonomous atomic scale processing and selective growth”

Ainhoa Romo Negreira

Principal Engineer thin films, Tokyo Electron Europe, Belgium

“Controlling surface activation through inhibitor and surface preparation for Area-Selective Deposition Integration”

John F. Conley

Professor in Electrical Engineering and Computer Science, Oregon State University, USA

Talk title to be announced.

Thomas Knisley

Sr. Manager, Process Chemistry, Applied Materials, USA

“Enabling Materials-Driven Inflections in Advanced Microelectronics Through Selective Deposition”

Yukihiro Shimogaki

Professor, Department of Materials Engineering, The University of Tokyo, Japan

“Area-Selective Co Metal Capping for Reliable Cu/Low-k Interconnects: MLIP Analysis of Surface Blocking and Optical Monitoring of Nucleation and Growth”

Ron Pearlstein

Executive Director, EMD Electronics, USA

“Solving challenges in ASD from process design through high volume manufacturing”

Scott B. Clendenning

Technology Research, Intel Corporation, USA

“ASD applications and integration”

Francois Fabreguette

DRAM Pathfinding and Advanced Module Innovation, Micron Technology, USA

“From Selective Deposition to Selective Manufacturing: Lessons from Memory Integration”

Silvia Armini

Principal Member of Technical Staff, imec, Belgium

“Right Material, Right Place: From Surface Chemistry to Advanced IC Manufacturing”

Andrew McKerrow

Product Line Director, Lam Research, USA

Talk title to be announced.

Il-Kwon

Associate Professor, Electrical and Computer Engineering, Ajou University, South Korea

“Area-Selective Deposition for Device Integration: From Surface Engineering to Advanced Memory and Logic”